Joseph Ogbonna

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DIIDevHeads IoT Integration Server

•Created by aymen ammari on 5/9/2024 in #pcb-and-analog

What techniques can I employ to ensure thermal management and proper heat dissipation in my PCB layo

Increase your trace spacing so it can accumulate enough current. You can also add copper pour on your PCB and create some polygons, these also helps in heat management. Add the right amount of vias also. Anything again you can ask.

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