What techniques can I employ to ensure thermal management and proper heat dissipation in my PCB layo
Hello everyone, I have a problem... despite implementing thermal vias and heat sinks, inadequate thermal management in the PCB layout caused components to exceed their temperature ratings, leading to premature failure and reliability issues. What techniques can I employ to ensure thermal management and proper heat dissipation in my PCB layout, particularly for components prone to overheating?
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Increase your trace spacing so it can accumulate enough current.
You can also add copper pour on your PCB and create some polygons, these also helps in heat management.
Add the right amount of vias also. ...
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Solution
Increase your trace spacing so it can accumulate enough current.
You can also add copper pour on your PCB and create some polygons, these also helps in heat management.
Add the right amount of vias also.
Anything again you can ask.