When should I use PCB HDI in my board design?
When is it adviceable to use a HDI PCB Design in your board when doing designs. What are the things we should look into before choosing HDI as a choice for a design.
Solution:Jump to solution
One of the most frequent reasons is the fine pitch of a BGA package or packages that will be used. Such a fine pitch does not allow you to use standard THT vias for the footprint fanout. Then, you have to use microvias. In direct connection with the fine pitch BGA package is the number of pads of the particular package. For, let's say, 500+ pads, you need 8+ layers. It all depends on the PCB stack-up. The higher number of PCB layers inevitably leads you to use microvias because of the PCB thickn...
4 Replies
Solution
One of the most frequent reasons is the fine pitch of a BGA package or packages that will be used. Such a fine pitch does not allow you to use standard THT vias for the footprint fanout. Then, you have to use microvias. In direct connection with the fine pitch BGA package is the number of pads of the particular package. For, let's say, 500+ pads, you need 8+ layers. It all depends on the PCB stack-up. The higher number of PCB layers inevitably leads you to use microvias because of the PCB thickness (too narrow via holes cannot be used for thick boards). There is all connected.
Thanks, that means the more the pins the higher the stackup layer. And it's adviceable to use HDI if the pins are very small
No, it means the more tracks, the more layers needed to route them. Naturally, the more pads=the more tracks. Nobody uses big packages when there is no need for them.
Yes, the more the tracks the more the layers needed. It can also depend on the size of the PCB also. If space in not a constraint in the design, you could increase it a little so you can reduce layer count. But all depends on using the best compromise and trade off