Intel, Samsung, and TSMC Demo 3D-Stacked Transistors The Big Three can now all make CFETs—next stop
IEEE Spectrum
Intel, Samsung, and TSMC Demo 3D-Stacked Transistors
The Big Three can now all make CFETs—next stop on the Moore’s Law roadmap
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While a lot of smaller companies are coming up with the process and innovation in transistor technology, these giants are challenged to keep the bars set high. They always have scale and global strategy in place.
The collaborative efforts of Intel, Samsung, and TSMC showcasing 3D-stacked transistors mark a significant technological advancement. The development of CFETs (Complementary Field-Effect Transistors) represents a major stride in semiconductor technology. It would be interesting to explore the potential applications and implications of this joint achievement. What are your thoughts on the future impact of 3D-stacked transistors in the semiconductor industry?